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1. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
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Auteur:
Li, Simon; Fu, Yue; Li, Suihua
Uitgever:
Springer New York 2012
Type:
e-book
2. Knowledge Sharing through Technology
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Auteur:
Lam, Jeanne; Cheung, Simon K.S.; Cheung, Simon K. S.; Li, Kam Cheong; Wang, Fu Lee
Uitgever:
Springer Berlin Heidelberg 2013
Type:
e-book
3. Pro JSP 2
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Auteur:
Simon Brown; Brown, Simon; Dalton, Sam; Mukhar, Kevin; Jepp, Daniel; Johnson, David; Li, Sing; Raible, Matt
Uitgever:
A-Press 2005
Type:
e-book
4. Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
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Auteur:
Qian, Zhihong.; Cheung, Simon K. S.; Jabbar, M. A.; Li, Xiaolong
Uitgever:
Singapore Springer Singapore Pte. Limited 2023
Type:
e-book
5. Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
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Auteur:
Patrick Siarry; Cheung, Simon King Sing; Jabbar, M. A.; Li, Xiaolong
Uitgever:
Springer Nature Singapore 2025
Type:
e-book
6. Technology in Education. Transforming Educational Practices with Technology
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Auteur:
Li; Cheung, Simon K. S.; Lam, Jeanne; Li, Kam Cheong; Ng, Kwan Keung; Wong, Tak-Lam
Uitgever:
Springer Berlin Heidelberg 2015
Type:
e-book
7. Blended Learning: Re-Thinking and Re-defining the Learning Process : 14th International Conference, ICBL 2021, Nagoya, Japan, August 10-13, 2021, Proceedings
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Auteur:
Li, Richard; Cheung, Simon K. S.; Iwasaki, Chiaki; Kageto, Makoto; Kwok, Lam-For
Uitgever:
Springer International Publishing 2021
Type:
e-book
8. Blended Learning : 16th International Conference on Blended Learning, ICBL 2023, Hong Kong, China, July 17-20, 2023, Proceedings
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Auteur:
Li, Chen.; Cheung, Simon K. S.; Kwok, Lam For; Lu, Angel; Wang, Fu Lee
Uitgever:
Cham Springer 2023
Type:
e-book
9. Engaging Learners Through Emerging Technologies
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Auteur:
Li, Kam Cheong; Wang, Fu Lee; Cheung, Simon K. S.; Kwan, Reggie; Yuen, Kin Sun
Uitgever:
Springer Berlin Heidelberg 2012
Type:
e-book
10. Blended Learning : 15th International Conference, ICBL 2022, Hong Kong, China, July 19-22, 2022, Proceedings
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Auteur:
Li, Richard Chen.; Cheung, Simon K. S.; Ng, Peter H. F.; Wang, Fu Lee; Wong, Leung-Pun
Uitgever:
Cham Springer International Publishing AG 2022
Type:
e-book