3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization

MLA

Bamberg, Lennart, et al. 3d Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization. Cham: Springer International Publishing AG, 2022.

APA

Bamberg, L., García-Ortiz, A., Joseph, J. Moritz, & Pionteck, T. (2022). 3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization. Cham: Springer International Publishing AG.

Chicago

Bamberg, Lennart., Alberto García-Ortiz, Jan Moritz Joseph, and Thilo Pionteck. 3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization. Cham: Springer International Publishing AG, 2022.