Chiplet Design and Heterogeneous Integration Packaging

MLA

Lau, John H. Chiplet Design and Heterogeneous Integration Packaging. Singapore: Springer, 2023.

APA

Lau, J. H. (2023). Chiplet Design and Heterogeneous Integration Packaging. Singapore: Springer.

Chicago

Lau, John H. Chiplet Design and Heterogeneous Integration Packaging. Singapore: Springer, 2023.