Interconnect Reliability in Advanced Memory Device Packaging

MLA

Gan, Chong Leong, and Chen-Yu Huang. Interconnect Reliability In Advanced Memory Device Packaging. Cham: Springer International Publishing AG, 2023.

APA

Gan, C. Leong, & Huang, C. (2023). Interconnect Reliability in Advanced Memory Device Packaging. Cham: Springer International Publishing AG.

Chicago

Gan, Chong Leong., and Chen-Yu Huang. Interconnect Reliability In Advanced Memory Device Packaging. Cham: Springer International Publishing AG, 2023.