Advanced Materials for Thermal Management of Electronic Packaging

MLA

Tong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging. Springer New York, 2011.

APA

Tong, X. Colin. (2011). Advanced Materials for Thermal Management of Electronic Packaging. Springer New York.

Chicago

Tong, Xingcun Colin Advanced Materials for Thermal Management of Electronic Packaging. : Springer New York, 2011.