Advanced Flip Chip Packaging

MLA

Tong, Ho-Ming, Yi-Shao Lai, and C.P Wong. Advanced Flip Chip Packaging. Dordrecht: Springer US, 2013.

APA

Tong, H., Lai, Y., & Wong, C. (2013). Advanced Flip Chip Packaging. Dordrecht: Springer US.

Chicago

Tong, Ho-Ming, Yi-Shao Lai, and C.P Wong. Advanced Flip Chip Packaging. Dordrecht: Springer US, 2013.