Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

MLA

Wong, E-H, and Y.-W Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing, 2015.

APA

Wong, E., & Mai, Y. (2015). Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing.

Chicago

Wong, E-H, and Y.-W Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. : Woodhead Publishing, 2015.