MLA

Li, and Deepak Goyal. 3d Microelectronic Packaging. Springer Nature Singapore, 2021.

APA

Li, L., & Goyal, D. (2021). 3D Microelectronic Packaging. Springer Nature Singapore.

Chicago

Li, and Deepak Goyal. 3D Microelectronic Packaging. : Springer Nature Singapore, 2021.