Wafer-Level Chip-Scale Packaging

MLA

Qu, Shichun, and Yong Liu. Wafer-level Chip-scale Packaging. Springer New York, 2015.

APA

Qu, S., & Liu, Y. (2015). Wafer-Level Chip-Scale Packaging. Springer New York.

Chicago

Qu, Shichun, and Yong Liu. Wafer-Level Chip-Scale Packaging. : Springer New York, 2015.