3D Microelectronic Packaging

MLA

Li, Yan; Goyal, Deepak, and Deepak Goyal. 3d Microelectronic Packaging. Springer International Publishing, 2017.

APA

Li, D., & Goyal, D. (2017). 3D Microelectronic Packaging. Springer International Publishing.

Chicago

Li, Yan; Goyal, Deepak, and Deepak Goyal. 3D Microelectronic Packaging. : Springer International Publishing, 2017.