RF and Microwave Microelectronics Packaging II

MLA

Kuang, Ken; Sturdivant, Rick, and Rick Sturdivant. Rf and Microwave Microelectronics Packaging Ii. Springer International Publishing, 2017.

APA

Kuang, R., & Sturdivant, R. (2017). RF and Microwave Microelectronics Packaging II. Springer International Publishing.

Chicago

Kuang, Ken; Sturdivant, Rick, and Rick Sturdivant. RF and Microwave Microelectronics Packaging II. : Springer International Publishing, 2017.