MLA

K N, Subramanya, Mario Orlando Oliveira, and Hui-Ming Wee. Innovations In Electronic Materials : Iceamst 2024. Cham: Springer, 2025.

APA

K N, S., Oliveira, M. Orlando, & Wee, H. (2025). Innovations in Electronic Materials : Iceamst 2024. Cham: Springer.

Chicago

K N, Subramanya., Mario Orlando Oliveira, and Hui-Ming Wee. Innovations In Electronic Materials : Iceamst 2024. Cham: Springer, 2025.