Modeling and Application of Flexible Electronics Packaging

MLA

Huang, Xiaodong Wan, and Zhouping Yin. Modeling and Application of Flexible Electronics Packaging. Springer Singapore, 2019.

APA

Huang, H., Wan, X., & Yin, Z. (2019). Modeling and Application of Flexible Electronics Packaging. Springer Singapore.

Chicago

Huang, Xiaodong Wan, and Zhouping Yin. Modeling and Application of Flexible Electronics Packaging. : Springer Singapore, 2019.