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1. Materials for Advanced Packaging
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Author:
Lu, Daniel; Wong, C.P.; Wong, C. P.
Publisher:
Springer International Publishing 2017
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e-book
2. Materials for Advanced Packaging
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Author:
Unspecified; Lu, Daniel; Wong, C. P.
Publisher:
Springer US 2009
Format:
e-book
3. Electrical Conductive Adhesives with Nanotechnologies
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Author:
Wong, C.; Li, Yi (Grace); Lu, D.; Y, Li; Lu, Daniel; Wong, C. P.
Publisher:
Springer US 2010
Format:
e-book