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361. Advances in Thermal Engineering, Manufacturing, and Production Management

Auteur:: Sadhan Kumar Ghosh; Dan, Pranab Kumar; Das, Santanu; Ghosh, Koushik; Kundu, Arijit
Uitgever:: Springer Singapore 2021
Type:: e-book

362. Distributed Computing and Networking

Auteur:: Chaudhuri, Soma; Das, Samir R.; Kanade, Takeo; Paul, Himadri S.; Tirthapura, Srikanta
Uitgever:: Springer Berlin Heidelberg 2006
Type:: e-book

363. Green Nanoparticles

Auteur:: Patra, Jayanta Kumar; Campos, Estefânia Vangelie Ramos; Das, Gitishree; Fraceto, Leonardo F.
Uitgever:: Springer International Publishing 2020
Type:: e-book

364. Machine Learning and Metaheuristics Algorithms, and Applications

Auteur:: Thampi; Berretti, Stefano; Das, Swagatam; Li, Kuan-Ching; Trajkovic, Ljiljana; Wozniak, Michal
Uitgever:: Springer Singapore 2020
Type:: e-book

365. Nature-Inspired Optimization Methodologies in Biomedical and Healthcare

Auteur:: Nayak, Janmenjoy.; Brahnam, Sheryl; Das, Asit Kumar; Meher, Saroj K.; Naik, Bighnaraj
Uitgever:: Cham Springer International Publishing AG 2022
Type:: e-book

366. Optimum Cooling of Data Centers

Auteur:: Dai, Jun; Ohadi, Michael; Das, Diganta; Ohadi, Michael M.; Pecht, Michael G.
Uitgever:: Springer New York 2014
Type:: e-book

367. Proceedings of Fourth International Conference on Soft Computing for Problem Solving: SocProS 2014, Volume 1

Auteur:: Das, Kedar Nath; Bansal, Jagdish Chand; Deep, Kusum; Nagar, Atulya; Pant, Millie
Uitgever:: Springer India 2015
Type:: e-book

368. Proceedings of Fourth International Conference on Soft Computing for Problem Solving: SocProS 2014, Volume 2

Auteur:: Das, Kedar Nath; Bansal, Jagdish Chand; Deep, Kusum; Nagar, Atulya; Pant, Millie
Uitgever:: Springer India 2015
Type:: e-book

369. Proceedings of International Conference on Recent Advancement on Computer and Communication

Auteur:: Tiwari; Bansal, Jagdish C.; Das, Kinkar Chandra; Mishra, Durgesh Kumar; Tiwari, Vivek
Uitgever:: Springer Singapore 2018
Type:: e-book

370. Proceedings of the 3rd International Conference on Advances in Materials Processing : AMPCO 2022, 17-19 Oct, Roorkee, India

Auteur:: Tewari, Abhishek.; Agarwal, Gautam; Das, Sourav; Dhawan, Nikhil; Karmakar, Anish; Mishra, Sumeet
Uitgever:: Singapore Springer 2023
Type:: e-book