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1. Materials for Advanced Packaging
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Auteur:
Lu, Daniel; Wong, C.P.; Wong, C. P.
Uitgever:
Springer International Publishing 2017
Type:
e-book
2. Advanced Flip Chip Packaging
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Auteur:
Tong, Ho-Ming; Lai, Yi-Shao; Wong, C.P.
Uitgever:
Dordrecht Springer US 2013
Type:
e-book
3. Nano-Bio- Electronic, Photonic and MEMS Packaging
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Auteur:
C.P. Wong; Li, Grace Yi; Moon, Kyoung-Sik; Wong, C. P.; Li, Yi (Grace)
Uitgever:
Springer US 2010
Type:
e-book
4. Materials for Advanced Packaging
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Auteur:
Unspecified; Lu, Daniel; Wong, C. P.
Uitgever:
Springer US 2009
Type:
e-book
5. Electrical Conductive Adhesives with Nanotechnologies
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Auteur:
Wong, C.; Li, Yi (Grace); Lu, D.; Y, Li; Lu, Daniel; Wong, C. P.
Uitgever:
Springer US 2010
Type:
e-book
6. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Auteur:
Suhir, E.; Lee, Y. C.; Lee, Yung-Cheng; Suhir, Ephraim; Wong, C. P.
Uitgever:
Springer US 2007
Type:
e-book
7. Nano-Bio- Electronic, Photonic and MEMS Packaging
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Auteur:
C. P.(Ching-Ping) Wong; Li, Yi; Moon, Kyoung-sik (Jack)
Uitgever:
Springer International Publishing 2021
Type:
e-book