Advanced Flip Chip Packaging

Full text!
Type:
e-book
Titel:
Advanced Flip Chip Packaging
Auteur:
Tong, Ho-Ming; Lai, Yi-Shao; Wong, C.P.
Taal:
Engels
Uitgever:
Dordrecht Springer US 2013
ISBN:
1-4419-5767-7
1-4419-5768-5
Permalink:
http://bibtest.howest.be/catalog/ebk03:2670000000340814