Solder Joint Reliability Prediction for Multiple Environments

Type:: e-book
Titel:: Solder Joint Reliability Prediction for Multiple Environments
Auteur:: Perkins, Andrew E.; Sitaraman, Suresh K.; Unspecified
Taal:: Engels
Uitgever:: Springer US 2009
ISBN:: 0-387-79393-3
1-4419-4634-9
9786611954406
1-281-95440-3
0-387-79394-1
Permalink:: http://bibtest.howest.be/catalog/ebk03:1000000000546194