3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization

Type:

e-book

Titel:

3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization

Auteur:

Bamberg, Lennart.; García-Ortiz, Alberto; Joseph, Jan Moritz; Pionteck, Thilo

Taal:

Engels

Uitgever:

Cham Springer International Publishing AG 2022

ISBN:

3-030-98228-9
3-030-98229-7

Permalink:

http://bibtest.howest.be/catalog/ebk03:24094359900041