3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization

Full text!
Format:
e-book
Title:
3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
Author:
Bamberg, Lennart.; García-Ortiz, Alberto; Joseph, Jan Moritz; Pionteck, Thilo
Language:
English
Publisher:
Cham Springer International Publishing AG 2022
ISBN:
3-030-98228-9
3-030-98229-7
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