Interconnect Reliability in Advanced Memory Device Packaging - bib.howest.be

Interconnect Reliability in Advanced Memory Device Packaging

Format:: e-book
Title:: Interconnect Reliability in Advanced Memory Device Packaging
Author:: Gan, Chong Leong.; Huang, Chen-Yu
Language:: English
Publisher:: Cham Springer International Publishing AG 2023
ISBN:: 3-031-26707-9
3-031-26708-7
Permalink:: http://bibtest.howest.be/catalog/ebk03:26540727900041?locale=en