Advanced Materials for Thermal Management of Electronic Packaging

Type:: e-book
Titel:: Advanced Materials for Thermal Management of Electronic Packaging
Auteur:: Tong, Xingcun Colin
Taal:: Engels
Uitgever:: Springer New York 2011
ISBN:: 1-4419-7758-9
1-4614-2792-4
9786613083593
1-4419-7759-7
1-283-08359-0
Permalink:: http://bibtest.howest.be/catalog/ebk03:2670000000064906