Advanced Materials for Thermal Management of Electronic Packaging

Format:: e-book
Title:: Advanced Materials for Thermal Management of Electronic Packaging
Author:: Tong, Xingcun Colin
Language:: English
Publisher:: Springer New York 2011
ISBN:: 1-4419-7758-9
1-4614-2792-4
9786613083593
1-4419-7759-7
1-283-08359-0
Permalink:: http://bibtest.howest.be/catalog/ebk03:2670000000064906?locale=en