Advanced Flip Chip Packaging

Full text!
Format:
e-book
Title:
Advanced Flip Chip Packaging
Author:
Tong, Ho-Ming; Lai, Yi-Shao; Wong, C.P.
Language:
English
Publisher:
Dordrecht Springer US 2013
ISBN:
1-4419-5767-7
1-4419-5768-5
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http://bibtest.howest.be/catalog/ebk03:2670000000340814?locale=en