Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Format:: e-book
Title:: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author:: Wong, E-H; Mai, Y.-W.
Language:: English
Publisher:: Woodhead Publishing 2015
ISBN:: 1-84569-528-3
0-85709-911-6
Permalink:: http://bibtest.howest.be/catalog/ebk03:2670000000617882?locale=en