3D Microelectronic Packaging

Type:

e-book

Titel:

3D Microelectronic Packaging

Auteur:

Li; Goyal, Deepak

Taal:

Engels

Uitgever:

Springer Nature Singapore 2021

ISBN:

981-15-7089-2
981-15-7090-6

Permalink:

http://bibtest.howest.be/catalog/ebk03:31385962000041