Designing TSVs for 3D Integrated Circuits

Type:

e-book

Titel:

Designing TSVs for 3D Integrated Circuits

Auteur:

Khan, Nauman; Hassoun, Soha

Taal:

Engels

Uitgever:

Springer New York 2013

ISBN:

1-4614-5507-3
1-4614-5508-1
1-283-64036-8

Permalink:

http://bibtest.howest.be/catalog/ebk03:3400000000085990