Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Format:: e-book
Title:: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author:: Noia, Brandon; Noia; Chakrabarty, Krishnendu
Language:: English
Publisher:: Springer International Publishing 2014
ISBN:: 3-319-02377-2
3-319-02378-0
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