Wafer-Level Chip-Scale Packaging

Format:: e-book
Title:: Wafer-Level Chip-Scale Packaging
Author:: Qu, Shichun; Liu, Yong
Language:: English
Publisher:: Springer New York 2015
ISBN:: 1-4939-1555-X
1-4939-1556-8
Permalink:: http://bibtest.howest.be/catalog/ebk03:3710000000238296?locale=en