Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Type:: e-book
Titel:: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Auteur:: Zhang, Qingke
Taal:: Engels
Uitgever:: Springer Berlin Heidelberg 2016
ISBN:: 3-662-48821-3
3-662-48823-X
Permalink:: http://bibtest.howest.be/catalog/ebk03:3710000000498943