3D Microelectronic Packaging

Format:: e-book
Title:: 3D Microelectronic Packaging
Author:: Li, Yan; Goyal, Deepak; Goyal, Deepak
Language:: English
Publisher:: Springer International Publishing 2017
ISBN:: 3-319-44584-7
3-319-44586-3
Permalink:: http://bibtest.howest.be/catalog/ebk03:3710000001041152?locale=en