Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Format:: e-book
Title:: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author:: Cheng, Jie
Language:: English
Publisher:: Springer Singapore 2018
ISBN:: 981-10-6164-5
981-10-6165-3
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