Modeling and Application of Flexible Electronics Packaging
Full text!- Format:
- e-book
- Title:
- Modeling and Application of Flexible Electronics Packaging
- Language:
- English
- Publisher:
- Springer Singapore 2019
- ISBN:
- 981-13-3626-1
981-13-3627-X - Permalink:
- http://bibtest.howest.be/catalog/ebk03:4100000008525770?locale=en