Assembly and Reliability of Lead-Free Solder Joints

Type:

e-book

Titel:

Assembly and Reliability of Lead-Free Solder Joints

Auteur:

Lau; Lee, Ning-Cheng

Taal:

Engels

Uitgever:

Springer Singapore 2020

ISBN:

981-15-3919-7
981-15-3920-0

Permalink:

http://bibtest.howest.be/catalog/ebk03:4100000011273640