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1. Nano-Bio- Electronic, Photonic and MEMS Packaging
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Author:
C.P. Wong; Li, Grace Yi; Moon, Kyoung-Sik; Wong, C. P.; Li, Yi (Grace)
Publisher:
Springer US 2010
Format:
e-book
2. Materials for Advanced Packaging
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Author:
Lu, Daniel; Wong, C.P.; Wong, C. P.
Publisher:
Springer International Publishing 2017
Format:
e-book
3. Advanced Flip Chip Packaging
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Author:
Tong, Ho-Ming; Lai, Yi-Shao; Wong, C.P.
Publisher:
Dordrecht Springer US 2013
Format:
e-book
4. Materials for Advanced Packaging
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Author:
Unspecified; Lu, Daniel; Wong, C. P.
Publisher:
Springer US 2009
Format:
e-book
5. Nano-Bio- Electronic, Photonic and MEMS Packaging
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Author:
C. P.(Ching-Ping) Wong; Li, Yi; Moon, Kyoung-sik (Jack)
Publisher:
Springer International Publishing 2021
Format:
e-book
6. Electrical Conductive Adhesives with Nanotechnologies
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Author:
Wong, C.; Li, Yi (Grace); Lu, D.; Y, Li; Lu, Daniel; Wong, C. P.
Publisher:
Springer US 2010
Format:
e-book
7. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Author:
Suhir, E.; Lee, Y. C.; Lee, Yung-Cheng; Suhir, Ephraim; Wong, C. P.
Publisher:
Springer US 2007
Format:
e-book