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1. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Author:
Wong, E-H; Mai, Y.-W.
Publisher:
Woodhead Publishing 2015
Format:
e-book
2. Advances in Fracture Research
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Author:
Carpinteri, A.; Carpinteri, Alberto; Mai, Y. W.; Mai, Yiu-Wing; Ritchie, Robert O.
Publisher:
Springer Netherlands 2006
Format:
e-book