Chiplet Design and Heterogeneous Integration Packaging - bib.howest.be

Chiplet Design and Heterogeneous Integration Packaging

Type:: e-book
Titel:: Chiplet Design and Heterogeneous Integration Packaging
Auteur:: Lau, John H.
Taal:: Engels
Uitgever:: Singapore Springer 2023
ISBN:: 981-19-9916-3
981-19-9917-1
Permalink:: http://bibtest.howest.be/catalog/ebk03:26347416200041