Interconnect Reliability in Advanced Memory Device Packaging - bib.howest.be

Interconnect Reliability in Advanced Memory Device Packaging

Type:: e-book
Titel:: Interconnect Reliability in Advanced Memory Device Packaging
Auteur:: Gan, Chong Leong.; Huang, Chen-Yu
Taal:: Engels
Uitgever:: Cham Springer International Publishing AG 2023
ISBN:: 3-031-26707-9
3-031-26708-7
Permalink:: http://bibtest.howest.be/catalog/ebk03:26540727900041