3D Microelectronic Packaging

Type:

e-book

Titel:

3D Microelectronic Packaging

Auteur:

Li, Yan; Goyal, Deepak; Goyal, Deepak

Taal:

Engels

Uitgever:

Springer International Publishing 2017

ISBN:

3-319-44584-7
3-319-44586-3

Permalink:

http://bibtest.howest.be/catalog/ebk03:3710000001041152