RF and Microwave Microelectronics Packaging II

Type:

e-book

Titel:

RF and Microwave Microelectronics Packaging II

Auteur:

Kuang, Ken; Sturdivant, Rick; Sturdivant, Rick

Taal:

Engels

Uitgever:

Springer International Publishing 2017

ISBN:

3-319-51696-5
3-319-51697-3

Permalink:

http://bibtest.howest.be/catalog/ebk03:3710000001095335