Modeling and Application of Flexible Electronics Packaging

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Type:
e-book
Titel:
Modeling and Application of Flexible Electronics Packaging
Auteur:
Huang; Wan, Xiaodong; Yin, Zhouping
Taal:
Engels
Uitgever:
Springer Singapore 2019
ISBN:
981-13-3626-1
981-13-3627-X
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http://bibtest.howest.be/catalog/ebk03:4100000008525770